手动键合机

Orthodyne Orthodyne 20 wirebonder

This is an Orthodyne 20 wire bonder, used for precision electronics assembly.
The device is equipped with a microscope for detailed inspection during operation.
These machines are often used for ultrasonic bonding in the semiconductor industry.

The Orthodyne Model 20 is a manual ultrasonic heavy-wire wedge bonder primarily used for connecting power semiconductors (power devices), hybrid circuits, and power electronics with aluminum wire.

Key specifications
Property Specification
Bonding method Ultrasonic wedge bonding
Wire material Aluminum
Wire diameter 4–20 mil (≈ 102–508 µm), depending on configuration
Commonly used wire sizes 5 mil, 10 mil, 12 mil, and 20 mil
Maximum bonding force Up to 1000 grams
Ultrasonic power Up to 550 (machine setting)
Working area Vacuum chuck with approx. 75 mm working diameter
Operation Manual, under microscope
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Microscope Stereo zoom optics, typically 7×–40× depending on the model
Applications
IGBT and MOSFET modules
Power hybrids
DCB substrates
Ceramic substrates (Al₂O₃, AlN)
Thick aluminum bond wires for high currents
Features
Suitable for large aluminum wires up to 20 mil.
Special Larrison bonding tools reduce wire damage and heel cracking.
Automatic wire cutting during the second bond.
Optionally available with deep-access clamps and a video camera for improved positioning.

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