电线键合机

K&S 8020 K&S 8020

Known K&S 8020 Specifications
Specification Value
Bonding type Automatic thermosonic ball bonder
Wire material Gold wire (Au)
Bond head Voice-coil direct-drive bond head
Ultrasonic transducer 120 kHz unibody transducer with adaptive USG
Vision system 20/20 vision system
Camera Sony XC-75 CCD
Bond pitch capability Sub-70 µm pitch kit available
Bond area 2.0 × 2.3 in (≈ 50.8 × 58.4 mm)
Optics Universal optics with increased depth of field
Illumination LED
Workholder 250-series heated manual workholder
Power 208 V, 50/60 Hz
Control Software-controlled automatic bonding programs
Typical Process Capability

Hsdpfx Aozdgm Dsqpjfh
The 8020 was developed to provide:

Fine-pitch bonding
Long, low wire loops
Improved process control
High throughput for leadframe and laminate packages
Automated vision alignment and pattern recognition

These capabilities were key selling points of the 8000 family.

Applications
Plastic IC packages
SOIC, QFP, TSOP
Memory devices
ASICs
Hybrid microelectronics
Chip-on-board assemblies
Physical Characteristics

Unfortunately, a complete factory datasheet with dimensions, weight, XY-table resolution, bond-force range, and supported wire diameters is not readily available in public archives. Most of the available information comes from listings of used equipment and K&S annual reports.

If you need details such as:

Bond force range (grams)
Wire diameter range (e.g., 0.7–2.0 mil)
XY positioning resolution
Air requirements
Maintenance manual
Error codes or calibration procedures

该广告为自动翻译，可能存在翻译错误。